Introducing the MVP 900 Series. Automated Optical Inspection for Wafer, Die, Wire-bond, Micro-Electronics and Semiconductor Inspection

The 900 series is a modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting. Camera and optics are scalable to resolutions below 1 Micron. In addition a range of custom material handling configurations are available including; magazine handling, strip handling, tray handling and wafer handling

MVP 900 Series – Wafer, Die and Wire-Bond Inspection and much more. Focused on Quality, Metrology and Automation, the 900 series provide automated inspection and measurement solutions to the semiconductor, microelectronics and high-reliability markets.

MVPs 900 platforms provide the highest resolution 2D & 3D Capabilities and optics for Semiconductor, Microelectronics, Packaging and CMM.

Using high resolution 3D systems, 12MP cameras, Multi-tier lighting and Multipass technology MVPs 900 series can provide the inspection coverage while achieving the required UPH.

MVP’s proprietary algorithms allow for inspection and metrology on all Microelectronics. Automation is key to the 900’s flexibility.