MVP's Aurora system provides Packaged IC and Component Inspection including; Ball Grid Arrays (BGA), Quad Flat Packs (QFP), Thin Quad Flat Package (TQFP), Chip Scale Package (CSP), Wafer-Level Package (WLP), Quad Flatpack No-Leads (QFN), Bump Chip Carrier (BCC), Land Grid Array (LGA).
utilizes high-resolution imaging, quad color lighting and 3D
Laser Profilers to produce maximum defect, and measurement
capabilities for Thin Board, Lead-Frame, Die and Wire Bond
inspection.
Join us at Semicon Taiwan in Taipei to discuss your AOI requirements
MVP's innovative AutoData is a scaleable solution for all your critical data storage requirements.