Double Sided Automated Inspection and Metrology for Packaged IC, BGA and Leaded Devices - MVP Aurora

MVP Aurora systems are designed using dual technologies that are specifically designed to enable the best inspection capabilities. For topside package inspection, high resolution telecentric optics are available to measure device dimensions, inspect part markings and provide surface inspection. For the underside Balls/Leads our shadow free 3D technology is used to provide coplanarity and positional measurements.

The Aurora uses a Pick-Inspect-Sort methodology to provide to Provide Multi-Sided Package inspection. Once the Inspection is complete bad parts are placed in the defect tray and good parts returned to the original tray. The Stack of parts originally loaded for inspection will only have devices that have passed all the inspection requirements.

MVPs Aurora system provides Packaged IC and Component Inspection. Commonly used for your Outgoing or Incoming Quality Control (OQC, IQC) it can inspect package types including; Ball Grid Arrays (BGA), Quad Flat Packs (QFP), Thin Quad Flat Package (TQFP), Chip Scale Package (CSP), Wafer-Level Package (WLP), Quad Flatpack No-Leads (QFN), Bump Chip Carrier (BCC), Land Grid Array (LGA), and more…