Lead Frame Inspection – 2030 DWMS
MVP’s 2030 DWMS (Die Wire Metrology System) is a new dedicated lead frame inspection AOI and uses advanced optic and handling solutions to provide the latest in Die and Wire-Bond inspection. Inspection techniques include high-resolution telecentric imaging, quad color lighting, and 3D techniques to provide the maximum defect, and measurement capabilities for Lead Frame, Die Epoxy, and Wire Bond inspection.
MVP’s 2030 DWMS AOI system is configured as standard with integrated MVP leadframe magazine loaders and unloaders designed for error free operation at the highest of UPH demands.
Machine Vision Products, Inc. has designed it’s own robust integrated magazine loader and unloader solution for it’s 2030 DWMS lead frame inspection AOI solution. High performance Electro-Optics solutions are scaleable dependent on the customer inspection criteria and range from 1.7um to 5.6um. With a three stage high speed material handling throughput is typically dependent on lead frame density with typical UPH ranges of 20,000 to 150,000.
The 2030 DWMS can be configured with with multiple post inspection options. MVP supports inline or onboard post defect marking options. For inline MVP provides ink marking, puncher or wire cutter modules. Inline post inspection options provide the user with a separate stage allowing the UPH to be maximized. Further detail on MVP’s post inspection options click here.
