Microelectronics and Packaging AOI
Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
MVP 900 Series
MVP 2030 Series
MVP’s 2030 DWMS (Die Wire Metrology System) is MVP’s latest dedicated lead frame inspection AOI and uses advanced optic and handling solutions to provide the latest in Die and Wire-Bond inspection. Inspection techniques include high-resolution telecentric imaging, quad color lighting, and 3D techniques to provide the maximum defect, and measurement capabilities for Lead Frame, Die Epoxy, and Wire Bond inspection.
System Manufacturing, Applications and Customer Focus
Based in Vista, California, MVP provide full design and manufacturing services for all their optics, hardware and custom handling solutions. Our skilled, machinists, assembly and test engineers provide the highest quality system solutions. In addition MVP provide software for all of the platforms from a core team of experts based in our Vista HQ location.
MVP’s proprietary algorithm suite provides the highest level of inspection for integrated automatic production lines, built around a series of high resolution 20 and 3D optics packages, to provide rapid, cost-efficient measurement of microelectronics and semiconductor components.
Once a solution has been deployed, MVP continues customer and applications support through a class-leading team off-field based engineers. System installation, training, applications development, project managment and system enhancements are all services provided by MVP to any location world-wide.
