MVP Aura - Single Sided Package Inspection

Single Sided Automated Inspection and Metrology for Packaged IC, BGA and Leaded Devices - MVP Aura

MVP’s Aura platform takes in-line package inspection to the next level. Key features include;

  • Top side inspection
  • Automated in-line tray loading
  • Automated part sorting
  • Pin/ball Position
  • Height, and Coplanarity measurements

Additionally, MVP’s Aura uses the latest advanced 3D high-resolution imaging to provide inspection and measurement capabilities for today’s most demanding devices and packages.

MVP Aura Brochure
More Information
Defect Examples

Key Features

  • Dual Technology Inspection - 2D and 3D
  • Single-side Inspection
  • Full Inspection: Height, Position, Metrology and Coplanarity Measurements
  • In-Line JEDEC Tray Handling
  • Sorting to Defect Tray
  • Interchangeable Vacuum Nozzles for Large and Small Packages
  • No Part Size Constraints
  • Inspect Parts Independent of Size
  • Small Footprint

Capabiliities

  • Jedec Tray
  • In Line or Same Side In-Out Loader
  • SECS/GEM
  • XML Map Output for Downstream Sorting
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