Products Overview

900 Series

Class 100 Clean Room Options. High Resolution 3D. Microscopic Objective. 100-300mm Wafer. Wafer Frame/Lead Frame. Full Wire-Bond. Microelectronics.

900 Series
2030

2030 DWMS

Loader/Unloaders. 150,000+ UPH. Die Placement. Die Surface. Epoxy Spread. Bridging. Edge Crack. Wire Bond. Semi S2/S8 Compliant.

2030 DWMS

Versa

Versatile Capabilities. Paste. Pre/Post Reflow. Post-Wave. BGA. 12 MP Color Camera. 3D Lighting. 5-10um resolution. Projector/Laser 3D.

Versa

Spectra

Largest Format AOI. Up to 26″ x 38″ boards. Tri Linear Motion.

Spectra

Software Products

Engineering / Management Reports. Image Archiving. Data Mining / Archiving. Line/Material/WIP Management. MES Solutions.

Software