Double Sided Automated Inspection and Metrology for Packaged IC, BGA and Leaded Devices - MVP Aurora

MVP Aurora systems are designed using dual technologies that are specifically designed to enable the best inspection capabilities. For topside package inspection, high resolution telecentric optics are available to measure device dimensions, inspect part markings and provide surface inspection. For the underside Balls/Leads our shadow free 3D technology is used to provide coplanarity and positional measurements.

Designed to provide our smallest footprint, the MVP Aurora employs a Pick-Inspect-Sort methodology for comprehensive multi-sided package inspection. After inspection, defective parts are placed in a defect tray, while good parts are returned to their original tray. This process ensures that the stack of parts loaded for inspection contains only devices that have met all inspection criteria.

MVPs Aurora system provides Packaged IC and Component Inspection. Commonly used for your Outgoing or Incoming Quality Control (OQC, IQC) it can inspect package types including; Ball Grid Arrays (BGA), Quad Flat Packs (QFP), Thin Quad Flat Package (TQFP), Chip Scale Package (CSP), Wafer-Level Package (WLP), Quad Flatpack No-Leads (QFN), Bump Chip Carrier (BCC), Land Grid Array (LGA), and more…