MVP Carta M
MVP Carta M
MVP Carta C

MVP Carta Series- Flexible Automated Optical Inspection and Metrology for Wafer, Diced Wafer, and Beyond

 

MVP Carta Series – Flexible AOI and Metrology for Wafer and Advanced Packaging Inspection

The MVP Carta Series is a highly flexible Automated Optical Inspection (AOI) and metrology platform designed for semiconductor, microelectronics, and advanced packaging applications. Built on a common architecture, all MVP Carta systems feature dual-camera capability with high-resolution GigE 25MP imaging and advanced electro-optics, including microscope objective support for precision inspection and measurement.


The MVP Carta M provides maximum flexibility with manual loading, supporting a wide range of applications from full wafers to diced wafers, trays, and hybrid assemblies within a single platform.


The MVP Carta C introduces cassette-based handling for automated inspection of diced wafers on film frames, enabling consistent throughput, repeatability, and optional features such as vacuum handling, ring lift, and underside inspection.

Together, the Carta Series enables scalable deployment—from flexible, multi-format inspection to fully automated, high-throughput wafer processing—all within a unified AOI and metrology platform.

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Why Choose MVP Carta Series?

✔ Inspect wafers, diced wafers, film frames, trays, and hybrid assemblies on a single platform

✔ Combine high-precision AOI and metrology with advanced electro-optics and microscope objective capability

✔ Support multiple wafer formats (100–300mm) and film frames within a unified inspection architecture

✔ Enable scalable automation—from manual loading to cassette-based handling and fully automated FOUP and robotic systems

✔ Deliver high-resolution inspection with 25MP imaging, multi-spectral illumination, and optional IR and profiling technologies

✔ Intelligent microscopic inspection at every scale on an as needed basis.

✔ Simplify programming and operation with powerful software, CAD import, and automated wafer mapping

✔ Integrate seamlessly into manufacturing environments with SECS/GEM, e-Maps, and advanced data reporting

✔ Reduce system complexity and footprint while maximizing flexibility across multiple applications

Silicon Wafer
Silcon Wafer Macro
Dice Wafer
Digital camera sensor

Advanced Inspection and Metrology Capabilities:

  • Die surface and pattern inspection
  • Foreign Object Debris (FOD) detection
  • Die cracking inspection
  • Bump height measurement and profiling
  • Dimensional and surface metrology

Flexible Optics and Imaging Configurations:

  • High-speed 25MP and 12MP cameras
  • Microscopic objectives
  • Multi-angle and multi-spectral illumination
  • Optional infrared (IR) imaging
  • Optional high-resolution profiler for height measurements

Intelligent Software and Data Integration:

  • Simplified wafer mapping and program generation
  • Unified inspection interface using MVP’s diagnostic algorithms
  • Offline program generation and debug environment
  • Multi-pass inspection with programmable lighting and heights
  • Integrated defect review (in-line or off-line)
  • SECS/GEM, e-Maps, and ELSR (End Lot Summary Reporting)
  • Optional AutoData DPC, MVP’s SQL-based data reporting platform, provides advanced SPC, reporting, and process control.