MVP Carta M
MVP Carta C
MVP Carta F

MVP Carta Series- Flexible Automated Optical Inspection and Metrology for Wafer, Diced Wafer, and Beyond

 

MVP Carta Series – Flexible AOI and Metrology for Wafer and Advanced Packaging Inspection

The MVP Carta Series is a highly flexible Automated Optical Inspection (AOI) and metrology platform designed for semiconductor, microelectronics, and advanced packaging applications. Built on a common architecture, all MVP Carta systems feature dual-camera capability with high-resolution GigE 25MP imaging and advanced electro-optics, including microscope objective support for precision inspection and measurement.


The MVP Carta M provides maximum flexibility with manual loading, supporting a wide range of applications from full wafers to diced wafers, trays, and hybrid assemblies within a single platform.


The MVP Carta C introduces cassette-based handling for automated inspection of diced wafers on film frames, enabling consistent throughput, repeatability, and optional features such as vacuum handling, ring lift, and underside inspection.


The MVP Carta F delivers fully automated wafer inspection for post-fab, pre-dicing applications, integrating FOUP handling and robotic wafer transfer to support high-volume manufacturing environments.


Together, the Carta Series enables scalable deployment—from flexible, multi-format inspection to fully automated, high-throughput wafer processing—all within a unified AOI and metrology platform.

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Why Choose MVP Carta Series?

✔ Inspect wafers, diced wafers, film frames, trays, and hybrid assemblies on a single platform

✔ Combine high-precision AOI and metrology with advanced electro-optics and microscope objective capability

✔ Support multiple wafer formats (100–300mm) and film frames within a unified inspection architecture

✔ Enable scalable automation—from manual loading to cassette-based handling and fully automated FOUP and robotic systems

✔ Deliver high-resolution inspection with 25MP imaging, multi-spectral illumination, and optional IR and profiling technologies

✔ Intelligent microscopic inspection at every scale on an as needed basis.

✔ Simplify programming and operation with powerful software, CAD import, and automated wafer mapping

✔ Integrate seamlessly into manufacturing environments with SECS/GEM, e-Maps, and advanced data reporting

✔ Reduce system complexity and footprint while maximizing flexibility across multiple applications

Silicon Wafer
Silcon Wafer Macro
Dice Wafer
Digital camera sensor

Advanced Inspection and Metrology Capabilities:

  • Die surface and pattern inspection
  • Foreign Object Debris (FOD) detection
  • Die cracking inspection
  • Bump height measurement and profiling
  • Dimensional and surface metrology

Flexible Optics and Imaging Configurations:

  • High-speed 25MP and 12MP cameras
  • Microscopic objectives
  • Multi-angle and multi-spectral illumination
  • Optional infrared (IR) imaging
  • Optional high-resolution profiler for height measurements

Intelligent Software and Data Integration:

  • Simplified wafer mapping and program generation
  • Unified inspection interface using MVP’s diagnostic algorithms
  • Offline program generation and debug environment
  • Multi-pass inspection with programmable lighting and heights
  • Integrated defect review (in-line or off-line)
  • SECS/GEM, e-Maps, and ELSR (End Lot Summary Reporting)
  • Optional AutoData DPC, MVP’s SQL-based data reporting platform, provides advanced SPC, reporting, and process control.