Post Inspection Options – MVP 2030 DWMS
The MVP 2030 DWMS can be configured to host a wide selection of post AOI inspection defect identification options.
MVP support inline or offline review and repair, ink stamping, wire cutting and punch out of defective devices. In addition MVP also provide capability to communicate XML defect maps to downstream processes.
Ink Marking Module
Ink Marking is available as a post inspection or inline option on the 2030 DWMS. The inline option mounts the inker directly to the moving stage of the AOI machine marking post inspection.
For the inline option the ink marker is mounted within its own dedicated module and works in parallel with the inspection cycle times removing any impact to UPH
Puncher Module
The puncher is available as a post inspection inline option on the 2030 DWMS. The puncher module acts to physically punch out a section of the device rendering as an electrical fail at upstream processes.
The puncher marker is mounted within its own dedicated module and works in parallel with the inspection cycle times removing any impact to UPH.
Wire Ripper Module
Wire ripping is available as a post inspection or inline option on the 2030 DWMS. The inline option mounts the wire ripper directly to the moving stage of the AOI machine and then performing the rip post inspection.
For the inline option the wire ripper is mounted within its own dedicated module and works in parallel with the inspection cycletimes removing any impact to UPH.
XML Mapping
XML maps are a standard option provided on the MVP 900 and 2030 DWMS. Handshaking with upstream processes the XML maps share defect pass/fail data with any upstream process to including a variety of markers, encapsulators to ensure that defective devices remain unprocessed and fail all upstream tests.
