Products Overview

Combines 3D technologies and MVP’s advanced optic systems.

Detects complex defects using MVP’s proprietary algorithms.

Flexible for SPI, Pre-Reflow, Post-Reflow, or Post-Wave inspection.

Semiconductor, microelectronics, and high-reliability markets.

Modular AOI Inspection platform with advanced optics and handling solutions.

3D, high-resolution imaging, quad color lighting, and scalable camera and optics.

A dedicated lead frame inspection Automated Optical Inspection solution

High-resolution telecentric imaging, quad color lighting, and 3D techniques.

Defect and measurement capabilities for Lead Frame, Die Epoxy, and Wire Bond

Die and Wire-Bond Inspection solution for Lead Frame and Substrate inspection.

Proprietary algorithms enable inspection and metrology on all Microelectronics.

System Advantage - Automation provides flexibility.

High-resolution telecentric optics for topside. Shadow-free 3D for underside AOI

Automated tray loading, automated part sorting, and measurements of pin/ball position, height, and coplanarity.

Single or Dual sided package inspection.

Two configurations: ALW (fully automated) and 900 W (manual load).

Supports wafer sizes from 100mm to 300mm.

Detects contamination, delamination, foreign material, scratches, and cracks.