microelectronics inspection AOI

Automotive Inspection - MVP 900 AMS

The MVP 900 AMS model is specifically designed for the inspection challenges of the Automotive Electronics industry. Today’s automotive sector is heavily driven by electronics, including autonomous and sensory assistance, electric and hybrid technologies as well as a multitude of electronics and engine managements systems.

The 900 AMS is configured with the latest Multi-Processor and Multi-threaded architecture with high speed SSD and DDR memory to cover even the most complex of inspection challenges. With multiple high resolution camera options the AMS offers high positional accuracy and repeatability.

Automotive inspection challenges include high definition sensor technology, thick and thin wire bond, tape bond and hybrid technology along with traditional SMT.

MVP has a significant history of successful deployment of AOI system within the biggest of Automotive companies for approaching 30 years.

Key Features

  • Wedge Bond Inspection
  • Highest Throughput
  • Full Module Traceability with AutoData

Options

  • In-Line Loading
  • Manual Load Configuration
  • Laser Profiler for Loop Height