Products Overview

Class 100 Clean Room Options. High Resolution 3D. Microscopic Objective. 100-300mm Wafer. Wafer Frame/Lead Frame. Full Wire-Bond. Microelectronics.

Loader/Unloaders. 150,000+ UPH. Die Placement. Die Surface. Epoxy Spread. Bridging. Edge Crack. Wire Bond. Semi S2/S8 Compliant.

Versatile Capabilities. Paste. Pre/Post Reflow. Post-Wave. BGA. 12 MP Color Camera. 3D Lighting. 5-10um resolution. Projector/Laser 3D

Largest Format AOI. Up to 26″ x 38″ boards. Tri Linear Motion.

Engineering / Management Reports. Image Archiving. Data Mining / Archiving. Line/Material/WIP Management. MES Solutions.

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