microelectronics inspection AOI

Dice Wafer Inspection (Film Frame) - MVP 900 DW/ADW

The MVP 900 is available in two configurations for Dice Wafer Inspection. The ADW supports full automation with an MVP film frame cassette loader. Standard Film Frame sizes are supported up to 300mm. The 900 DW is a low cost manual load configuration with same side load/unload.

The 900 DW/ADW is configured with high resolution optics and custom lighting, providing the basis for proprietary high performance algorithms to detect:

  • Contamination/Discoloration
  • Die Metrology Defects 
  • Edge Cracks
  • Foreign Material/Debris
  • Scratches/Cracks
MVP 900 BROCHURE
More Information
Silicon wafer with microchips fixed in a holder with a steel frame after the dicing process and separate microchips. Silicon Wafers with microchips - used in electronics for the fabrication of integrated circuits.Color silicon wafers with glare.
Holding microchip with pair of tweezers Silicon wafer with microchips on background.
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Macro of a digital camera photo sensor chip

Key Features

  • 2D and 3D Capable
  • Up to 300mm Film Frame
  • 0.35um to > 3.4um Optical Resolution
  • Multi-Spectral Lighting
  • Real-Time Process Monitoring
  • Ease of Use Inspection Recipe Generation
  • Standard Wafers and Multi Project Wafers Supported

Options

  • High Resolution Laser Profiler
  • Manual Loading
  • Automatic Film Frame Cassette Loading
  • Film Frame Vacuum or Support Plate
  • Film Frame Flipper for Under Film Inspection
  • SECS/GEM
  • XML Map Output for Downstream Sorting
  • Ink Marking for Defect Locations