In Tray BGA and Sensor Inspection - MVP 900 T/TS

The MVP 900 T is designed specifically for In-Tray inspection of components such as BGA, Sensors and other Package Types. Supported tray options are for Jedec, Waffle Pack and Auer Boat. The optional TS model provides additional defect handling capabilities by providing sorting of failed parts into a separate tray on completion of the inspection sequence.

The 900 T/TS configuration provides a range of advanced optic and handling options including 3D Laser Profiler, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for in-tray BGA, sensor and package inspection.

MVP 900 BROCHURE
More Information
microchip bga with lead balls for repair computer equipment
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Key Features (BGA)

  • 2D and 3D Capable
  • Ball Height – Referenced to Substrate
  • Coplanarity
  • Offset and Position
  • Diameter
  • Damage
  • Shape
  • Edge and Surface
  • Package Metrology

Key Features (Sensors)

  • Package Dimensions
  • Foreign Material/Debris
  • Contamination
  • Scratches/Cracks
  • Package Metrology

Options

  • Jedec Tray
  • Waffle Pack
  • Same Side In-Out Loader
  • Loader to Unloader Handling
  • SECS/GEM
  • XML Map Output for Downstream Sorting
  • Ink Marking for Defect Locations