die and wire inspection AOI

Die and Wire Bond Inspection - MVP 900 DWMS

The MVP 900 Series is a modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting. Camera and optics are scalable to resolutions below 1 Micron. 

Focused on Quality, Metrology and Automation, the 900 series provide automated inspection and measurement solutions to the semiconductor, microelectronics and high-reliability markets.

The MVP 900 DWMS (Die Wire Metrology System) is a dedicated Die and Wire-Bond Inspection solution dedicated for Lead Frame inspection. 

MVP’s proprietary algorithms allow for inspection and metrology on all Microelectronics. Automation is key to the 900’s flexibility.

900 Brochure
MicroElectonics Guide
More Info
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CPU central processor unit isolated on white. 3d
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Key Features

  • 3 Stage Conveyor System
  • Dual Sided Load/Unload
  • Strips Lead-frames Auer boats, J-Boats, Trays
  • Die Placement Metrology
  • Die Surface, Edge Crack Detection
  • Epoxy Spread and Flow Measurement
  • Au, Al, Ag, and Cu Wires to 1um Resolution
  • Wedge, Ball, and Stitch Wire Bonds
  • Crescent, and Tape Bonds
  • SMT Components

Options

  • High Resolution Laser Profiler
  • 12 or 25 MP Camera
  • AutoWidth
  • Vacuum
  • SECS/GEM
  • XML Map Output for Downstream Sorting
  • Ink Marking on Optics Head for Defect Locations