wafer AOI inspection

Wafer Inspection (100-300mm) - MVP 900 W/ALW

The MVP 900 is available in two configurations for Wafer Inspection. The ALW supports full automation integrated with a single arm robot and a pre-aligner. Wafer sizes are supported from 100 through 300mm. The 900 W is a low cost manual load configuration with same side load/unload.

The 900 W/ALW is configured with high resolution optics and custom lighting providing the basis for proprietary high performance algorithms to detect:

  • Contamination/Discoloration
  • Delamination
  • Foreign Material/Debris
  • Scratches/Cracks
MVP 900 BROCHURE
More Information
9832427 - silicon wafer with processor cores isolated on white background
Macro of silicon wafers. Selective focus.
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Macro of a digital camera photo sensor chip

Key Features

  • 2D and 3D Capable
  • 100, 150, 200 and 300mm Wafers
  • 0.35um to > 3.4um Optical Resolution
  • Surface Inspection
  • Bump Inspection 25um to 500um
  • Multi-Spectral Lighting
  • Real-Time Process Monitoring

Options

  • High Resolution Laser Profiler
  • Manual Loading
  • Automatic Loading
  • 3rd Party Handlers for SMIF, FOUP
  • Vacuum
  • SECS/GEM
  • XML Map Output for Downstream Sorting
  • Ink Marking for Defect Locations