MVP Carta - Flexible Automated Optical Inspection and Metrology for Wafer, Diced Wafer, and Beyond

The MVP Carta Series is a highly flexible Automated Optical Inspection (AOI) and metrology platform designed to meet the evolving demands of semiconductor, microelectronics, and advanced packaging manufacturers. With a compact footprint and unmatched versatility, Carta is the first system to combine complete wafer inspection flexibility with multiple product formats in a single platform.

Carta enables inspection and measurement of full wafers, diced wafers on film frames, tray-based products, and hybrid assemblies—all within the same system. This flexibility reduces capital equipment requirements while increasing inspection capability across multiple product types.

MVP Carta Brochure
More Info

Why Choose MVP Carta?

✔ Inspect wafers, diced wafers, trays, and hybrids in one system

✔ Combine AOI and metrology on a single platform

✔ Reduce equipment complexity and compact footprint

✔ Scale inspection capability as products evolve

✔ Built on MVP’s proven inspection and data infrastructure

9832427 - silicon wafer with processor cores isolated on white background
Macro of silicon wafers. Selective focus.
dreamstime_s_177838367_800x450
Macro of a digital camera photo sensor chip

Advanced Inspection and Metrology Capabilities:

  • Die surface and pattern inspection
  • Foreign Object Debris (FOD) detection
  • Die cracking inspection
  • Bump height measurement and profiling
  • Dimensional and surface metrology

Flexible Optics and Imaging Configurations:

  • High-speed 25MP and 12MP cameras
  • Microscopic objectives
  • Multi-angle and multi-spectral illumination
  • Optional infrared (IR) imaging
  • Optional high-resolution profiler for height measurements

Intelligent Software and Data Integration:

  • Simplified wafer mapping and program generation
  • Unified inspection interface using MVP’s diagnostic algorithms
  • Offline program generation and debug environment
  • Multi-pass inspection with programmable lighting and heights
  • Integrated defect review (in-line or off-line)
  • SECS/GEM, e-Maps, and ELSR (End Lot Summary Reporting)
  • Optional AutoData DPC, MVP’s SQL-based data reporting platform, provides advanced SPC, reporting, and process control.